Amkor Technology Remote Jobs From Home 22/Hour @Janhitjobs ( Director )

Amkor Technology Remote Jobs From Home 22/Hour @Janhitjobs ( Director )

Job Responsibilities: Director

Salary: 22/Hour

Company: Amkor Technology 

Location: Boise , USA

Educational Requirements: Graduate

Full Job Description:  

Position Outline:

Amkor is as of now looking for a Chief, High level Bundle Improvement and Mix for our Tempe, AZ office. The essential capability of this position is program the board for improvement of cutting edge chiplet-based modules like HDFO (High Thickness Fan-out) and other high level IC bundle developments for figuring, systems administration and PC client market spaces. This individual will be the essential connection point with Level 1 clients and Amkor's driving edge Research and development focus in South Korea.

Amkor Technology Remote Jobs From Home 22/Hour @Janhitjobs ( Director )

Fundamental Obligations:

• Drive and direction improvement exercises with clients and related to Amkor's advancement groups in Korea.

• Lead Level 1 client interface gatherings, conversations and subsequent meet-ups during project advancement.

• Coordinate and team up with all organization assets as are expected to execute Research and development projects that will surpass all client prerequisite.

• Oversee cross useful groups contained plan community and portrayal assets as well as cycle improvement in Research and development, to streamline novel plans and to lay out plan rules for new IC bundle families.

• Oversee item the executives through beginning creation slope.

Required Capabilities:

• This position requires a Four year certification in Designing (Mechanical, Substance, or Materials Science); Graduate degree is liked.

• 12+ long periods of involvement with semiconductor bundling improvement is required, at least 10 years with a Graduate degree.

• The certified competitor will actually want to work freely in a worldwide association with exhibited insight in IC bundle process improvement.

• The certified up-and-comer comprehends the IC bundle plan climate, and compromises related with bundle plan during bundle process improvement for FCCSP and FCBGA bundles.

• Direct past item the executives experience including seaward cycle advancement is exceptionally wanted.

• Profound information on IC bundling materials, disappointment mode and dependability capability systems is required.

• Incredible composed and verbal relational abilities required.

• This position requires 20% homegrown and 20% worldwide travel.

Favored Capabilities:

• Skill in Fan-out IC Bundling, including Low thickness (LDFO), and high thickness (HDFO).

• Skill in enormous body FCBGA bundling: warpage control, stress the executives, underfill and TIM materials.

• Working information on semi-added substance plating sciences and gear.

• Information on warm or mechanical recreations and displaying and understanding got from these.

• Knowledge of Plan of Trials and Factual Cycle Control and skill with the making of item showcasing security is an or more.

Amkor Technology Remote Jobs From Home 22/Hour @Janhitjobs ( Director )